Home > SMT Solder Paste Printer >

High-speed fully automatic solder paste printer, suitable for PCB and CPH SMT production lines.

Product Categories

Guangdong Okai Intelligent Technology Co., Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

High-speed fully automatic solder paste printer, suitable for PCB and CPH SMT production lines.

Name: Highspeed fully automatic solder paste printer suitable for PCB and CPH SMT production lines
Brand: Okai Intelligent Technology Co., Ltd.
Price: 1 USD

Quality High-speed fully automatic solder paste printer, suitable for PCB and CPH SMT production lines. for sale

Alignment System : CCD Digital Vision

PCB Thickness : 0.4-6mm

Model Number : OK-SASPP-600

Min PCB Size : 50×50mm

Cycle Time : under 8s standard mode

Power Supply : AC 220V 50/60Hz 3KW

Place of Origin : Guangdong, China

Price : open to negotiation

Max PCB Size : 510×460mm

Throughput : Up to 3,000 CPH

Printing Accuracy : ±30μm

Payment Terms : T/T

Supply Ability : 200 Sets per Month

Stencil Frame : 737×737mm

MOQ : 1 Set

Brand Name : Okai Intelligent Technology Co., Ltd.

Certification : ISO 9001

Packaging Details : Wooden case with foam protection, suitable for sea/air freight

Repeat Accuracy : ±15μm

Delivery Time : 7-15 working days after payment

Printer Model : OK-SASPP-600

Contact Now

OK-SASPP-600-H High Speed Fully Automatic Solder Paste Printer

The OK-SASPP-600-H is engineered for maximum throughput in high-volume SMT production environments. With a class-leading 8-second cycle time and capacity exceeding 3,000 CPH, this printer eliminates the stencil printing bottleneck that plagues many high-speed pick-and-place lines.

Key Features

8-Second Cycle Time: Optimized motion control with high-speed servo drives minimizes board handling, alignment, and printing overhead
3,000 Plus CPH Throughput: Dual-lane conveyor supports continuous board flow with zero-wait changeover
Fast Vision Alignment: Mark point recognition completes optical alignment in under 1 second
Automatic Stencil Cleaning: Integrated dry/wet/vacuum cleaning with programmable frequency keeps stencil apertures clear
PCB Warp Compensation: Auto-leveling Z-axis with 4-point height sensing compensates for board warpage up to 3mm
Quick Changeover: Tooling-free rail adjustment and recipe recall enable line changeover in under 3 minutes

Technical Specifications

Parameter	Value
Alignment System	CCD Digital Vision Fast Mode
Repeat Accuracy	±15μm
Printing Accuracy	±30μm
Max PCB Size	510*460mm
Min PCB Size	50*50mm
Cycle Time	under 8s standard mode
Throughput	Up to 3,000 CPH
Power Supply	AC 220V 50/60Hz, 3KW

Applications

Ideal for high-volume consumer electronics manufacturing: smartphone mainboards, tablet PCBs, power bank modules, LED driver boards, and IoT device assembly where production speed directly impacts line profitability.

Packaging and Shipping

Export wooden crate packaging with PE moisture barrier and EPE cushioning. Shipping by sea in 15-25 days or air in 5-7 days. Installation and operator training available upon request.

Product Tags: