Semi-automatic Solder Paste Printing Machine
I. Parameters of All Models
Model 1
Model: SASPP-400
Compatible PCB Board: Length 400mm, Width 50~250mm
Compatible Stencil: Maximum 650×550mm
Worktable: 500×320mm
Model 2
Model: SASPP-600
Compatible PCB Board: Length 600mm, Width 50~250mm
Compatible Stencil: Maximum 850×550mm
Worktable: 700×320mm
Model 3
Model: SASPP-1200
Compatible PCB Board: Length 1200mm, Width 50~250mm
Compatible Stencil: Maximum 1400×550mm
Worktable: 1300×320mm
Model 4
Model: SASPP-1500
Compatible PCB Board: Length... 1500mm in diameter, 50~250mm wide
Compatible stencil: Maximum 650×550mm
Worktable: 1600×320mm
SASPP-400 Machine Detailed Specifications
External Dimensions: 700×900×1680mm
Printing Table: 500×320mm
Standard Stencil Size: 600×500mm
Power Supply: 220V, 0.35KW
Working Air Pressure: 4-6bar
Equipment Weight: 180kg
Printing Accuracy: ±0.01mm
Optional Accessories
1. Vacuum Suction Cup Device: Customizable, suitable for FPC flexible boards, memory modules, cooling chips, etc., effectively preventing the board from sticking to the stencil and achieving smooth demolding.
2. Squeegee Specifications: Standard configuration includes 200mm and 250mm squeegees; customizable 300mm extended squeegees are available to meet different printing size requirements.
II. Equipment Features
1. The machine body adopts a closed sheet metal + aluminum alloy combined structure, providing strong protection and ensuring safe and durable use.
2. Equipped with a touch screen operation panel, along with automatic fault diagnosis and dual audible and visual alarm functions, it is easy to operate and troubleshoot.
3. Utilizes a PLC control system, ensuring stable operation and suitability for long-term continuous operation.
4. The lifting structure, combined with cylinders and linear guides, ensures smooth and stable lifting without deviation.
5. The left and right cutting tools are equipped with stepper motors, guide rails, and frequency converters, ensuring uniform and smooth operation.
6. Equipped with X/Y axis micro-adjustment knobs for precise position adjustment; the frequency conversion speed control design ensures low vibration during machine operation.
III. Application Scenarios
1. Electronic Circuit Board Processing: Used for solder paste printing on circuit boards of mobile phones, computers, tablets, and other products, accurately applying solder paste to the pads to prepare for subsequent component soldering processes.
2. Thermal Conductive Coating Processing: Capable of accurately applying thermal grease between electronic heat-generating components and heat dissipation parts, resulting in a uniform coating and improving the equipment's heat dissipation capacity and operational stability.
| Model No. |
Compatible PCB Size |
Max Compatible Stencil Size |
| SASPP-400 |
400mm(L) × 50~250mm(W) |
650mm × 550mm |
| SASPP-600 |
600mm(L) × 50~250mm(W) |
850mm × 550mm |
| SASPP-1200 |
1200mm(L) × 50~250mm(W) |
1400mm × 550mm |
| SASPP-1500 |
1500mm(L) × 50~250mm(W) |
650mm × 550mm |
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